| | Material (Manufacturer) Code | Composition | Lot number | Fillers % | Manufacturer recommendation |
| Clearfil Tri-S Bond Plus adhesive
One-step self-etch
(Kuraray Noritake Dental, Japan)
TP | Adhesive: MDP, Bis-GMA, HEMA, hydrophilic aliphatic dimethacrylate, hydrophobic aliphatic methacrylate, colloidal silica, sodium fluoride, dl-camphorquinone, accelerators, initiators, ethanol, water, others (). | 00007A | — | Adhesive
(i) Apply bond for 10 s
(ii) Dry with mild pressure air flow for 5 s
(iii) Light cure for 10 s | Estelite Sigma Quick
Universal composite
(Tokuyama Dental, Japan)
EQ | Composite: Bis-GMA, TEGDMA, silica–zirconia fillers, silica–titania fillers, photoinitiators. | J018 | 82% (wt.)
71% (vol) | Composite
(i) Light cure the composite for 10 s, keeping the curing light tip within a distance of 2 mm from the surface | Silorane system adhesive
Two-step self-etch
(3M ESPE, USA)
SA | Primer: phosphorylated methacrylates, Vitrebond copolymer, Bis-GMA, HEMA, water, ethanol, silane-treated silica filler, initiators, stabilizers (pH: 2.7). | N289224 | — | Primer
(i) Apply primer for 15 s
(ii) Gentle air dry
(iii) Light cure for 10 s | | Bond: hydrophobic dimethacrylate, phosphorylated methacrylates, TEGDMA, silane-treated silica filler, initiators, stabilizers. | N209848 | — | Bond
(i) Apply bond
(ii) Gentle air dry
(iii) Light cure for 10 s | Filtek Silorane
Low shrinkage posterior composite
(3M ESPE, USA)
FS | Composite: silorane resin, CQ, iodonium salt, electron donor, quartz filler, yttrium fluoride, stabilizers, pigments. | N204592 | 76% (wt.)
55% (vol) | Composite
(i) Light cure the composite for 20 s, keeping the curing light tip within a distance of 2 mm from the surface |
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