Influence of Diode Laser for the Treatment of Dentin Hypersensitivity on Microleakage of Cervical Restorations

Table 1

The materials used in the study and their composition, application method, and manufacturers.

Materials (class of material—group code)	Compositions	Method of application	Manufacturer
3M Universal Single Bond (universal adhesive)	MDP phosphate monomer, dimethacrylate resin, HEMA, ethanol, silane	Applied to the entire surface of the enamel and dentin and rubbed for 20 seconds. Gently air dried for approximately 5 seconds and light cured for 10 sec	3M ESPE, St. Paul, MN, USA
Filtek Z350 XT (nanohybrid composite resin—CR)	Bis-GMA, bis-EMA, UDMA, TEGDMA, zirconia/silica (-75 nm, -1.4 μm, 59.5 vol%)	Placed incrementally after adhesive was applied. Each increment was light cured for 20 sec	3M ESPE, St. Paul, MN, USA
Photac Fil (resin-modified glass ionomer cement—RMGI)	Polyethylene polycarbonic acid 2, hydroxyethyl methacrylate, water, diurethane dimethacrylate, magnesium, HEMA, ester	The capsule was activated and mixed in an amalgamator for 10 sec and placed in two-increment bulk. Each increment was light cured for 20 msec	3M ESPE, St. Paul, MN, USA
Ketac Universal (conventional glass ionomer cement—GIC)	Powder: . Liquid: water (40–60 wt%), copolymer of acrylic acid-maleic acid (30-50 wt%), tartaric acid (1-10 wt), and benzoic acid (<0.2 wt%)	The capsule was activated and mixed in an amalgamator for 10 sec and placed in bulk	3M ESPE Dental Products, St. Paul, USA

MDP phosphate: 10-methacryloyloxydecyl dihydrogen phosphate; HEMA: 2-hydroxyethyl methacrylate; bis-GMA: bisphenol A-glycidyl methacrylate; bis-EMA: ethoxylated bisphenol glycol dimethacrylate; UDMA: urethane dimethacrylate; TEGDMA: triethylene glycol dimethacrylate. Compositions are as disclosed by the manufacturers.