| | Group | Etching: | Materials (abbreviations) | Composition | Application technique |
| | G1 | Total-etching | Filtek Z350 XT (Z350) | Silane-treated ceramics, Bis-GMA, Bis-EMA, silane-treated silica, silane-treated zirconia oxide, dimethacrylate diurethane, polyethylene glycol dimethacrylate, TEGDMA, BHT | Oblique increments of 2 mm in thickness | | G5 | Self-etching | | G2 | Total-etching | Filtek Z350 XT flow (ZF) | Silane-treated ceramics, substitute dimethacrylate, Bis-GMA, silane-treated silica, TEGDMA, ytterbium fluoride, functionalized dimethacrylate polymer, and titanium dioxide | Oblique increments of 2 mm in thickness | | G6 | Self-etching | | G3 | Total-etching | Filtek One Bulk Fill (FBP) | Silane-treated zirconia/silica filler, UDMA, silane-treated zirconia, ytterbium fluoride, DDDMA, silane-treated zirconia, water, AFM-1 monomer, ERGP-DMA, curing agents, stabilizers, dyes | Increments of 5 mm in thickness without conventional resin coating | | G7 | Self-etching | | G4 | Total-etching | Filtek Bulk Fill Flow (FBF) | Ceramics treated with silane, UDMA, substituted dimethacrylate, Bis-EMA, ytterbium fluoride, Bis-GMA, benzotriazole, TEGDMA, and ethyl 4-dimethylaminobenzoate. | Increments of 4 mm in thickness and coverage with conventional resin | | G8 | Self-etching |
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