Research Article
On-Orbit Thermal Design and Validation of 1 U Standardized CubeSat of STEP Cube Lab
Table 10
On-orbit temperature prediction after thermal design modification on the battery.
| Component | Without MLI on the battery (°C) | With MLI on the battery (°C) | Hot operation | Cold operation | Cold emergency | Hot operation | Cold operation | Cold emergency | | | | | | |
| panel | 56.20 | −43.90 | −44.75 | 56.88 | −44.12 | −44.29 | panel | 49.89 | −33.64 | −34.52 | 52.15 | −34.39 | −34.41 | panel | 33.54 | −42.08 | −44.75 | 33.52 | −41.90 | −43.06 | panel | −3.78 | −39.13 | −43.36 | −2.37 | −40.32 | −40.58 | I/F board | 36.16 | −25.60 | −25.77 | 37.96 | −25.51 | −25.75 | GPS board | 15.67 | −8.19 | −8.80 | 18.24 | −7.21 | −9.91 | OBC board | 26.62 | −15.68 | −18.21 | 27.30 | −15.53 | −16.10 | Comm. board | 19.46 | −9.47 | −11.98 | 20.35 | −9.55 | −10.83 | Power board | 14.61 | −20.49 | −22.76 | 18.32 | −20.47 | −21.20 | Battery | 26.90 | −3.78 | −8.07 | 27.81 | 2.64 | 1.84 | MEMS | 30.96 | −26.77 | −30.41 | 29.46 | −28.27 | −28.57 | SEC | 58.20 | −35.20 | −36.18 | 59.45 | −36.18 | −36.04 | PCM | 19.52 | −7.18 | −9.39 | 20.36 | −7.44 | −8.64 | HRM | 17.25 | 2.03 | −0.20 | 17.26 | 1.82 | 0.60 |
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