Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

<div>Maximum principal in-plane strain of PCB in accordance with compression ratio of the thermal gap pad in each case.</div>

International Journal of Aerospace Engineering

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Figure 15

Figure 15: Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 

Figure 15 | Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 