Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

<div>Fatigue life on solder joint for CCGA624 package with respect to the fatigue life in each case.</div>

International Journal of Aerospace Engineering

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Figure 16

Figure 16: Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 

Figure 16 | Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 