Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation

<div>Representative metallographic microscope photographs of the solder joint for CCGA624 package ((a) Full crack, (b) Partial crack).</div>

International Journal of Aerospace Engineering

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Figure 9

Figure 9: Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 

Figure 9 | Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation 