Research Article
Experimental Validation of Fatigue Life of CCGA 624 Package with Initial Contact Pressure of Thermal Gap Pads under Random Vibration Excitation
Table 5
Material properties for structural analyses.
| | Item | Material | Young’s modulus (MPa) | Poisson’s ratio | Density (kg/m3) |
| | Column lead | 80Pb/20Sn | 20,000 | 0.36 | 10,200 | | Solder | 37Pb/63Sn | 29,367 | 0.36 | 8490 | | Solder pad | Copper | 128,000 | 0.3 | 8940 | | Package | Alumina ceramic (Al2O3) | 215,000 | 0.3 | 3620 | | PCB | FR-4 | 18,600 | 0.13 | 1850 | | Heat sink | Al6061-T651 | 68,900 | 0.33 | 2700 |
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