Preliminary Thermal Design and Analysis of Lunar Lander for Night Survival

Table 7

Specification of electronic packages.

Package type	PBGA	TSSOP
Configuration
Number of pins	324	48
Dimensions (mm)	19 × 19 × 2.2	12.5 × 6.1 × 1.2
Mass (g)	1.4	0.3
Solder material	Sn-Pb37	Sn-Pb37
Lead material	—	Copper
Package no.	U1, U4, U5, U6, U9	U2, U3, U7, U8