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International Journal of Antennas and Propagation
Volume 2007, Article ID 68385, 7 pages
http://dx.doi.org/10.1155/2007/68385
Review Article

Novel “Enhanced-Cognition” RFID Architectures on Organic/Paper Low-Cost Substrates Utilizing Inkjet Technologies

School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta 30332, GA, USA

Received 2 March 2007; Accepted 10 September 2007

Academic Editor: Junho Yeo

Copyright © 2007 Li Yang et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. K. Finkenzeller, RFID Handbook: Fundamentals and Applications in Contactless Smart Cards and Identification, John Wiley & Sons, New York, NY, USA, 2nd edition, 2004.
  2. R. Weinstein, “RFID: a technical overview and its application to the enterprise,” IT Professional, vol. 7, no. 3, pp. 27–33, 2005. View at Publisher · View at Google Scholar
  3. T. Carrico and F. Perich, “Cognitive situation monitoring and awareness of grid systems,” in Proceedings of IEEE Military Communications Conference (MILCOM '05), vol. 3, pp. 1807–1812, Atlatnic City, NJ, USA, October 2005. View at Publisher · View at Google Scholar
  4. A. Ferrer-Vidal, A. Rida, S. Basat, L. Yang, and M. M. Tentzeris, “Integration of sensors and RFID's on ultra-low-cost paper-based substrates for wireless sensor networks applications,” in Proceedings of the 2nd IEEE Workshop on Wireless Mesh Networks (WiMesh '06), pp. 126–128, Reston, Va, USA, September 2006. View at Publisher · View at Google Scholar
  5. V. Subramanian, J. M. J. Fréchet, and P. C. Chang et al., “Progress toward development of all-printed RFID tags: materials, processes, and devices,” Proceedings of the IEEE, vol. 93, no. 7, pp. 1330–1338, 2005. View at Publisher · View at Google Scholar
  6. B. Farrell and M. St. Lawrence, “The processing of liquid crystalline polymer printed circuits,” in Proceedings of the 52nd Electronic Components and Technology Conference (ECTC '02), pp. 667–671, San Diego, Calif, USA, May 2002. View at Publisher · View at Google Scholar
  7. K. Jayaraj, T. E. Noll, and D. Singh, “RF characterization of a low cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits,” in Proceedings of the 3rd International Symposium on Signals, Systems and Electronics (URSI '95), pp. 443–446, October 1995. View at Publisher · View at Google Scholar
  8. G. Zou, H. Gronqvist, P. Starski, and J. Liu, “High frequency characteristics of liquid crystal polymer for systemin a package application,” in Proceedings of the 8th International Symposium on Advanced Packaging Materials (ISAPM '02), pp. 337–341, Stone Mountain, Ga, USA, March 2002. View at Publisher · View at Google Scholar
  9. G. Zou, H. Grönqvist, J. P. Starski, and J. Liu, “Characterization of liquid crystal polymer for high frequency system-in-a-package applications,” IEEE Transactions on Advanced Packaging, vol. 25, no. 4, pp. 503–508, 2002. View at Publisher · View at Google Scholar
  10. A. Piqué and D. B. Chrisey, Eds., Direct-Write Technologies for Rapid Prototyping Applications, Academic Press, San Diego, Calif, USA, 2002.
  11. M. C. Lessard, L. van Nifterik, M. Masse, J. F. Penneau, and R. Grob, “Thermal aging study of insulating papers used in power transformers,” in Proceedings of the Annual Report of the Conference on Electrical Insulation and Dielectric Phenomena (CEIDP '96), vol. 2, pp. 854–859, Millbrae, Calif, USA, October 1996. View at Publisher · View at Google Scholar
  12. S. Simula, S. Ikäläinen, K. Niskanen, T. Varpula, H. Seppä, and A. Paukku, “Measurement of the dielectric properties of paper,” Journal of Imaging Science and Technology, vol. 43, no. 5, pp. 472–477, 1999.
  13. D. C. Thompson, O. Tantot, H. Jallageas, G. E. Ponchak, M. M. Tentzeris, and J. Papapolymerou, “Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz,” IEEE Transactions on Microwave Theory and Techniques, vol. 52, no. 4, pp. 1343–1352, 2004. View at Publisher · View at Google Scholar
  14. L. Yang, S. Basat, A. Rida, and M. M. Tentzeris, “Design and development of novel miniaturized UHF RFID tags on ultra-low-cost paper-based substrates,” in Proceedings of Asia Pacific Microwave Conference (APMC '06), Yokohama, Japan, December 2006.
  15. L. Yang, S. Basat, and M. M. Tentzeris, “Design and development of novel inductively coupled RFID antennas,” in Proceedings of IEEE Antennas and Propagation Society International Symposium (APS '06), pp. 1035–1038, Albuquerque, NM, USA, July 2006. View at Publisher · View at Google Scholar
  16. T. Braun, K.-F. Becker, M. Koch, V. Bader, R. Aschenbrenner, and H. Reichl, “Flip chip molding-recent progress in flip chip encapsulation,” in Proceedings of the 8th International Symposium on Advanced Packaging Materials (ISAPM '02), pp. 151–159, Stone Mountain, Ga, USA, March 2002. View at Publisher · View at Google Scholar
  17. S. L. Khoury, D. J. Burkhard, D. P. Galloway, and T. A. Scharr, “A comparison of copper and gold wire bonding on integrated circuit devices,” in Proceedings of the 40th Electronic Components and Technology Conference (ECTC '90), vol. 1, pp. 768–776, Las Vegas, Nev, USA, May 1990. View at Publisher · View at Google Scholar
  18. X. J. Zhao and J. F. J. M. Caers, “To simulate the formation of TSSOP solder joint with SAC solder and assess on the effects of the stencil design and the misalignment on the joint shape,” in Proceedings of the 6th Electronics Packaging Technology Conference (EPTC '04), pp. 313–317, Singapore, December 2004.
  19. J. B. Bates, N. J. Dudney, B. J. Neudecker, and B. Wang, “Thin-film lithium batteries,” in New Trends in Electrochemical Technology: Energy Storage Systems in Electronics, pp. 453–485, Gordon and Breach, Singapore, 2000.
  20. R. Supino and J. Talghader, “Optical power-scavenging system for fluidic microsensors,” in Proceesings of IEEE/LEOS International Conference on Optical MEMS and Their Applications (OMEMS '05), pp. 79–80, Oulu, Finland, August 2005. View at Publisher · View at Google Scholar
  21. K.-Y. Lin, T. K. K. Tsang, M. Sawan, and M. N. El-Gamal, “Radio-triggered solar and RF power scavenging and management for ultra low power wireless medical applications,” in Proceedings of IEEE International Symposium on Circuits and Systems (ISCAS '06), pp. 5728–5731, Kos, Greece, May 2006. View at Publisher · View at Google Scholar
  22. R. W. Hart, H. S. White, B. Dunn, and D. R. Rolison, “3-D microbatteries,” Electrochemistry Communications, vol. 5, no. 2, pp. 120–123, 2003. View at Publisher · View at Google Scholar