Table of Contents Author Guidelines Submit a Manuscript
International Journal of Antennas and Propagation
Volume 2014 (2014), Article ID 235847, 11 pages
Research Article

Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology

1School of Electronic Engineering, Xidian University, Xi’an, Shaanxi 710071, China
2School of Microelectronics, Xidian University, Xi’an, Shaanxi 710071, China

Received 2 August 2014; Revised 27 September 2014; Accepted 27 October 2014; Published 16 November 2014

Academic Editor: Qiang Chen

Copyright © 2014 Yongjiu Li et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


A low profile chip-package stacked-patch antenna is proposed by using low temperature cofired ceramic (LTCC) technology. The proposed antenna employs a stacked-patch to achieve two operating frequency bands and enhance the bandwidth. The height of the antenna is decreased to 4.09 mm (about /25 at 2.45 GHz) due to the shorted pin. The package is mounted on a 44 × 44 mm2 ground plane to miniaturize the volume of the system. The design parameters of the antenna and the effect of the antenna on chip-package cavity are carefully analyzed. The designed antenna operates at a center frequency of 2.45 GHz and its impedance bandwidth is 200 MHz, resulting from two neighboring resonant frequencies at 2.41 and 2.51 GHz, respectively. The average gain across the frequency band is about 5.28 dBi.