Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

Figure 11

4 × 4 multilayer TSV array, all TSVs are signal TSVs. There exist two copper layers on both sides serving as ground plane (parameters of the structure: thickness of the SnAg is 2 μm,  μm,  μm,  μm,  μm,  μm,  μm, and  μm).

(a) 4 × 4 multilayer TSV array

(b) Model in HFSS