Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

<table class="figure-group"><tr class="fig-image" id="a"><td><object data="https://static.hindawi.com/articles/ijap/volume-2015/470952/figures/470952.fig.009a.svgz" name="470952.fig.009a" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(a) </b><svg height="11.8565pt" id="M108" style="vertical-align:-3.05097pt" version="1.1" viewbox="-0.0498162 -8.80553 15.6664 11.8565" width="15.6664pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M463 633C453 636 427 644 417 648C388 660 349 667 316 667C183 667 100 592 100 483C100 398 176 335 223 305L259 282C321 242 358 203 358 149C358 66 301 22 234 22C110 22 70 131 57 208L24 205L28 48C51 23 128 -17 215 -17C342 -17 446 60 446 174C446 262 394 310 317 361L284 383C229 420 183 455 183 515C183 569 222 628 298 628C384 628 418 563 428 481L461 487C459 527 458 593 463 633Z" id="g50-84"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,6.149,3.001)"><path d="M414 144C384 79 371 75 317 75H135L276 221C367 316 408 376 408 465C408 570 327 635 237 635C179 635 131 609 100 575L42 494L67 471C94 510 138 565 205 565C277 565 321 517 321 435C321 348 258 270 195 195C146 137 88 81 33 26V0H411C423 44 433 88 446 135L414 144Z" id="g50-51"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,10.581,3.001)"><path d="M389 0V32C297 38 291 46 291 118V635C234 613 175 595 109 583V556L161 554C203 552 207 547 207 497V118C207 46 201 38 110 32V0H389Z" id="g50-50"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g></svg> and <svg height="11.8565pt" id="M109" style="vertical-align:-3.05097pt" version="1.1" viewbox="-0.0498162 -8.80553 15.6664 11.8565" width="15.6664pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M463 633C453 636 427 644 417 648C388 660 349 667 316 667C183 667 100 592 100 483C100 398 176 335 223 305L259 282C321 242 358 203 358 149C358 66 301 22 234 22C110 22 70 131 57 208L24 205L28 48C51 23 128 -17 215 -17C342 -17 446 60 446 174C446 262 394 310 317 361L284 383C229 420 183 455 183 515C183 569 222 628 298 628C384 628 418 563 428 481L461 487C459 527 458 593 463 633Z" id="g50-84"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,6.149,3.001)"><path d="M389 0V32C297 38 291 46 291 118V635C234 613 175 595 109 583V556L161 554C203 552 207 547 207 497V118C207 46 201 38 110 32V0H389Z" id="g50-50"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g><g transform="matrix(.0091,0,0,-0.0091,10.581,3.001)"><path d="M389 0V32C297 38 291 46 291 118V635C234 613 175 595 109 583V556L161 554C203 552 207 547 207 497V118C207 46 201 38 110 32V0H389Z" id="g50-50"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g></svg></td></tr><tr class="fig-image" id="b"><td><object data="https://static.hindawi.com/articles/ijap/volume-2015/470952/figures/470952.fig.009b.svgz" name="470952.fig.009b" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(b) </b>Far coupling</td></tr><tr class="fig-image" id="c"><td><object data="https://static.hindawi.com/articles/ijap/volume-2015/470952/figures/470952.fig.009c.svgz" name="470952.fig.009c" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(c) </b>Near coupling</td></tr></table>

<div><svg height="9.01192pt" id="M107" style="vertical-align:-0.2063904pt" version="1.1" viewbox="-0.0498162 -8.80553 6.33692 9.01192" width="6.33692pt" xmlns="http://www.w3.org/2000/svg" xmlns:xlink="http://www.w3.org/1999/xlink"><g transform="matrix(.013,0,0,-0.013,0,0)"><path d="M463 633C453 636 427 644 417 648C388 660 349 667 316 667C183 667 100 592 100 483C100 398 176 335 223 305L259 282C321 242 358 203 358 149C358 66 301 22 234 22C110 22 70 131 57 208L24 205L28 48C51 23 128 -17 215 -17C342 -17 446 60 446 174C446 262 394 310 317 361L284 383C229 420 183 455 183 515C183 569 222 628 298 628C384 628 418 563 428 481L461 487C459 527 458 593 463 633Z" id="g50-84"></path><glyph.data ascent="3443" descent="-2856" horiz-adv-x="487" vert-adv-y="487"></glyph.data></g></svg> parameters of the TSV model with different bump radius.</div>

International Journal of Antennas and Propagation

fig9

Figure 9

Figure 9: Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration 