Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration

Table 1

Parameters of proposed model.

Parameter	Symbol	Value
TSV height		100 μm
TSV radius		10 μm
SiO2 thickness		0.6 μm
TSV-TSV pitch		40 μm
Bump radius		15 μm
Bump height		5 μm
SiO2 plane thickness		1 μm