Research Article
Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
Table 2
Material property of proposed model.
| | Parameter | Symbol | Value |
| | Silicon conductivity | | 10 S/m | | TSV conductivity | | 5.8 107 S/m | | Bump conductivity | | 5.8 107 S/m | | Relative permittivity of silicon | | 11.9 | | Relative permittivity of SiO2 | | 4 | | Relative permittivity of BCB | | 2.65 | | Relative permeability of TSV | | 1 | | Relative permeability of bump | | 1 |
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