Dielectric Resonator Antennas: Basic Concepts, Design Guidelines, and Recent Developments at Millimeter-Wave Frequencies

Figure 31

Manufacturing process of the DRA as suggested in [73]. (a) Single silicon wafer. (b) 400 μm etching. (c) Back side coated with copper film. (d) Back side patterned for the feeding network.

(a)

(b)

(c)

(d)