Journals
Publish with us
Publishing partnerships
About us
Blog
International Journal of Antennas and Propagation
Journal overview
For authors
For reviewers
For editors
Table of Contents
Special Issues
International Journal of Antennas and Propagation
/
2016
/
Article
/
Fig 7
/
Research Article
A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages
Figure 7
Function of the matching pads for signal transfer simulation.
