Table of Contents Author Guidelines Submit a Manuscript
International Journal of Antennas and Propagation
Volume 2016, Article ID 9562854, 8 pages
http://dx.doi.org/10.1155/2016/9562854
Research Article

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

School of Physical Electronics, University of Electronic Science and Technology of China, No. 4, Section 2, North Jianshe Road, Chengdu 610054, China

Received 1 December 2015; Revised 2 February 2016; Accepted 21 February 2016

Academic Editor: Diego Masotti

Copyright © 2016 M. X. Yu. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. T. Kangasvieri, M. Komulainen, H. Jantunen, and J. Vähäkangas, “High performance vertical interconnections for millimeter-wave multichip modules,” in Proceedings of the 35th European Microwave Conference, vol. 1, pp. 169–172, Paris, France, October 2005. View at Publisher · View at Google Scholar · View at Scopus
  2. R. Sturdivant, C. Ly, J. Benson, and M. Hauhe, “Design and performance of a high density 3D microwave module,” in Proceedings of the 1997 IEEE MTT-S International Microwave Symposium, vol. 2, pp. 501–504, June 1997. View at Scopus
  3. W. Shi, Z. Qian, J. Zhou, X. Qu, Y. Xiang, and L. Hong, “A small ku-band polarization tracking active phased array for mobile satellite communications,” International Journal of Antennas and Propagation, vol. 2013, Article ID 747629, 12 pages, 2013. View at Publisher · View at Google Scholar · View at Scopus
  4. Y. He, F. Liu, F. Hou et al., “Design and implementation of a 700–2,600 MHz RF SiP module for micro base station,” Microsystem Technologies, vol. 20, no. 12, pp. 2295–2300, 2014. View at Publisher · View at Google Scholar · View at Scopus
  5. M. F. Shafique and I. D. Robertson, “Laser prototyping of multilayer LTCC microwave components for system-in-package applications,” IET Microwaves, Antennas and Propagation, vol. 5, no. 8, pp. 864–869, 2011. View at Publisher · View at Google Scholar · View at Scopus
  6. A. Bessemoulin, M. Parisot, P. Quentin, C. Saboureau, M. Van Heijningen, and J. Priday, “A 1-watt Ku-band power amplifier MMIC using cost-effective organic SMD package,” in Proceedings of the 34th European Microwave Conference, vol. 1, pp. 349–352, October 2004. View at Scopus
  7. S.-K. Yeo, J.-H. Chun, and Y.-S. Kwon, “A 3-D X-band T/R module package with an anodized aluminum multilayer substrate for phased array radar applications,” IEEE Transactions on Advanced Packaging, vol. 33, no. 4, pp. 883–891, 2010. View at Publisher · View at Google Scholar · View at Scopus
  8. F. Alimenti, P. Mezzanotte, G. Tasselli, A. Battistini, V. Palazzari, and L. Roselli, “Development of low-cost 24-GHz circuits exploiting system-in-package (SiP) approach and commercial PCB technology,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 8, pp. 1265–1274, 2012. View at Publisher · View at Google Scholar · View at Scopus
  9. S. Pan and J. Fan, “Characterization of via structures in multilayer printed circuit boards with an equivalent transmission-line model,” IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 5, pp. 1077–1086, 2012. View at Publisher · View at Google Scholar
  10. A. R. Diewald and R. H. Jansen, “Analysis of vertical via current increase due to via cylinder-to-ground capacitance,” in Proceedings of the IEEE 7th European Microwave Integrated Circuits Conference (EuMIC ’12), pp. 151–154, Amsterdam, The Netherlands, October 2012.
  11. C.-C. Tsai, Y.-S. Cheng, T.-Y. Huang, Y. A. Hsu, and R.-B. Wu, “Design of microstrip-to-microstrip via transition in multilayered LTCC for frequencies up to 67 GHz,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 4, pp. 595–601, 2011. View at Publisher · View at Google Scholar · View at Scopus
  12. A. R. Diewald and R. H. Jansen, “Analysis of vertical via current increase due to via cylinder-to-ground capacitance,” in Proceedings of the 7th European Microwave Integrated Circuits Conference (EuMIC ’12), pp. 151–154, Amsterdam, The Netherlands, October 2012.
  13. S. Wu, X. Chang, C. Schuster, X. Gu, and J. Fan, “Eliminating via-plane coupling using ground vias for high-speed signal transitions,” in Proceedings of the 17th Conference on Electrical Performance of Electronic Packaging (EPEP ’08), pp. 247–250, San Jose, Calif, USA, October 2008. View at Publisher · View at Google Scholar · View at Scopus
  14. R. Rimolo-Donadio, G. Selli, F. De Paulis et al., “Signal integrity: efficient, physics-based via modeling: integration of striplines,” IEEE Electromagnetic Compatibility Magazine, vol. 1, no. 2, pp. 74–81, 2012. View at Publisher · View at Google Scholar
  15. J. Fan, A. Hardock, R. Rimolo-Donadio et al., “Signal integrity: efficient, physics-based via modeling: return path, impedance, and stub effect control,” IEEE Electromagnetic Compatibility Magazine, vol. 3, no. 1, pp. 76–84, 2014. View at Google Scholar
  16. C.-C. Tsai and Y.-S. Cheng, “Design of microstrip-to-microstrip via transition in multilayered LTCC for frequencies up to 67 GHz,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 4, pp. 595–601, 2011. View at Publisher · View at Google Scholar
  17. E. R. Pillai, “Coax via-a technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling,” IEEE Transactions on Microwave Theory and Techniques, vol. 45, no. 10, pp. 1981–1985, 1997. View at Publisher · View at Google Scholar · View at Scopus
  18. S. Pan and J. Fan, “Characterization of via structures in multilayer printed circuit boards with an equivalent transmission-line model,” IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 5, pp. 1077–1086, 2012. View at Publisher · View at Google Scholar · View at Scopus
  19. E. Laermans, J. De Geest, D. De Zutter, F. Olyslager, S. Sercu, and D. Morlion, “Modeling differential via holes,” IEEE Transactions on Advanced Packaging, vol. 24, no. 3, pp. 357–363, 2001. View at Publisher · View at Google Scholar · View at Scopus
  20. C.-J. Ong, B. Wu, L. Tsang, and X. Gu, “Full-wave solver for microstrip trace and through-hole via in layered media,” IEEE Transactions on Advanced Packaging, vol. 31, no. 2, pp. 292–302, 2008. View at Publisher · View at Google Scholar · View at Scopus
  21. J. Kim, K. Shringarpure, J. Fan, J. Kim, and J. L. Drewniak, “Equivalent circuit model for power bus design in multi-layer PCBs with via arrays,” IEEE Microwave and Wireless Components Letters, vol. 21, no. 2, pp. 62–64, 2011. View at Publisher · View at Google Scholar · View at Scopus