Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Figure 7

Demonstrations of 3D printed RF components. (a) All-dielectric frequency selective surface under C-band testing. Reproduced with permission from [91]. (b) SEM image of postreliability tested printed gold wire interconnect. Reproduced with permission from [13]. (c) IJP-printed mm-wave Yagi-Uda antenna on flexible substrate. Reproduced with permission from [92]. (d) Multifunctional embedded electronics for a cubesat demonstration. Reproduced with permission from [93]. (e) IJP-printed phased array on a flexible substrate. Reproduced with permission from [94]. (f) Hybrid AM and DW demonstration of 3D-embedded structural electronics. Reproduced with permission from [95]. (g) A controllably folded inverted F antenna smart structure. Reproduced with permission from [96].

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