Review Article
Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities
Table 4
Thin film microstructure analysis.
| Characterization methods | AFM | XRD | Optical profilometer | SEM & TEM | Nanoindentation |
| Figures of merit | Surface roughness, line shape | Lattice parameter, crystal structure, phase analysis, residual stress, preferred orientation | Line shape, line widths, line thickness | Grain size, grain orientation, crystal defects, voids | Hardness, fracture toughness |
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