Review Article

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Table 4

Thin film microstructure analysis.

Characterization methodsAFMXRDOptical profilometerSEM & TEMNanoindentation

Figures of meritSurface roughness, line shapeLattice parameter, crystal structure, phase analysis, residual stress, preferred orientationLine shape, line widths, line thicknessGrain size, grain orientation, crystal defects, voidsHardness, fracture toughness