Performance Enhancements of Fully Inkjet-Printing Technology for Antenna-in-Package and Substrate Integrated Waveguides

Table 1

Distinct features of the proposed technique.

Reference	Fabrication of vias	Fabrication of wire bonding	Integration of fully inkjet-printed vias and an antenna
[3]	Copper microvias	N/A	No
[4]	Thin copper wire	N/A	No
[5]	Thin wire	N/A	No
[6]	Conductive epoxy	N/A	No
[28]	Copper pillars	N/A	No
[29]	Conductive epoxy	Conductive epoxy	No
[30]	Inkjet printing	N/A	Yes
[31]	Inkjet printing	N/A	No
[32]	N/A	Inkjet printing	No
This study	Inkjet printing	Inkjet printing	Yes