Advances in Low-Profile Antennas in Wireless Communications
1Microelectronic CAD Center, Hangzhou Dianzi University, Xiasha Higher Education Park, Hangzhou 310018, China
2Poly-Grames Research Centre and Department of Electrical Engineering, University of Montreal, QC, Canada H3T 1J4
3School of Information Science and Engineering, Southeast University, Nanjing 210096, China
4College of Electronic and Information Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
5School of Electronic Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu 611731, China
Advances in Low-Profile Antennas in Wireless Communications
Description
With rapid developments of wireless communications, low-profile antennas are in great demand, especially in handheld radios, wireless USB, wireless sensors networks, high-speed WPAN, and mobile devices. For their attractive characteristics such as light weight, good conformability, easy integration, and low cost fabrication, low-profile antennas have been extensively studied by researchers both in academia and industry.
Low-profile antennas can experience problems like high input reactance, low input resistance, and low radiation efficiency. One of the objectives of this special issue is to present development trends of novel methods and techniques to resolve the aforementioned problems. Prospective researchers are invited to contribute original research articles as well as review articles that will stimulate the development and deepen understanding of low-profile antennas’ design methods and their applications. Potential topics include, but are not limited to:
- Novel antenna designs (especially for integration on boards, in packages, on chips, etc.)
- Antenna miniaturization and optimization techniques
- Antenna performance improvement techniques (including bandwidth, efficiency, and gain)
- Feeding mechanisms and antenna arrays
- Antenna applications
Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ijap/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijap/lpa/ according to the following timetable: