Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Figure 10

XRD patterns of surface product of Sn-Ag-Cu, Sn-Cu-Ni, and Sn-Cu solder alloy and joint after 15-day immersion in 3.5 wt.% NaCl solution.