Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Table 2

Surface element concentration of different solders before potentiodynamic polarization in 3.5 wt.% NaCl solution.

	Surface element composition (atom%)
	Sn	Ag	Cu	Ni	Pb
Sn-Cu-Ni	98.59	-	1.27	0.14	-
Sn-Ag-Cu	96.74	2.74	0.52	-	-
Sn-Cu	98.97	-	1.38	-	-
Sn-Pb	59.03	-	-	-	40.97
Sn	100.00	-	-	-	-