Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Table 3

Surface element concentration of different solders after potentiodynamic polarization in 3.5 wt.% NaCl solution on specific points as indicated in Figure 4(c).

	Surface element concentration (atom%)
	Sn	Ag	Cu	Pb	Ni	Cl	O
Sn-Cu-Ni (A)	20.40	-	1.90	-	-	3.50	74.20
Sn-Cu-Ni (B)	56.70	-	0.80	-	-	0.20	42.30
Sn-Ag-Cu (A)	23.60	-	-	-	-	8.70	67.70
Sn-Ag-Cu (B)	32.30	-	0.20	-	-	12.10	55.40
Sn-Cu	20.50	-	0.10	-	-	10.70	68.70
Sn-Pb	28.40	-	-	-	-	0.60	71.00
Sn	29.90	-	-	-	-	15.00	55.10