Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Table 4

Cross-section element concentration of different solders after Potentiodynamic polarization tests in 3.5 wt.% NaCl solution.

	Cross-section element concentration (atom%)
	Sn	Ag	Cu	Ni	Pb	Cl	O
Sn-Cu-Ni
Top layer	63.99	-	0.60	0.22	-	0.92	33.91
Inner layer	98.59	-	1.27	0.14	-	-	-
Sn-Ag-Cu
Top layer	40.95	1.12	0.17	-	-	0.15	57.27
Inner layer	97.36	2.01	0.63	-	-	-	-
Sn-Cu
Top layer	64.58	-	0.72	-	-	0.60	33.35
Inner layer	99.30	-	0.70	-	-	-	-
Sn-Pb
Top layer	6.85	-	-	-	3.91	0.91	88.03
Inner layer	60.16	-	-	-	39.84	-	-
Sn
Top layer	32.62	-	-	-	-	0.37	66.41
Inner layer	99.85	-	-	-	-	0.15	-