Research Article
Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems
Table 1
Composition, solvent, classification, manufacturer, and batch numbers of the adhesive systems used in this study.
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HEMA: 2-hydroxyethyl methacrylate; BPDM: biphenyl dimethacrylate; Bis-GMA: bisphenol A diglycidyl ether dimethacrylate; UDMA, urethane dimethacrylate. Source: manufacturer documentation. |