Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

Table 1

Composition, solvent, classification, manufacturer, and batch numbers of the adhesive systems used in this study.

Adhesive systems	Composition	Solvent	Classification	Manufacturer	Batch numbers
ONE-STEP (OS)	BPDM, HEMA, Bis-GMA	Acetone	Etch-and-rinse	Bisco Inc., Schaumburg, IL, USA	1200013326
ONE-STEP Plus (OSP)	BPDM, HEMA, Dental Glass	Acetone	Etch-and-rinse	Bisco Inc., Schaumburg, IL, USA	1200013362
Ambar (AMB)	UDMA, HEMA, methacrylate acidic monomers, methacrylate hydrophilic monomers.	Ethanol	Etch-and-rinse	FGM, Joinville, SC, Brazil	41210
ScotchBond Universal (SBU)	MDP phosphate monomer, dimethacrylate resins, HEMA, silane, initiators, fillers	Ethanol/water	Multimode	3M ESPE, St. Paul, MN, USA	497908
All-Bond Universal (ABU)	Bis-GMA, MDP monomers	Ethanol	Multimode	Bisco Inc., Schaumburg, IL, USA	1300001314

HEMA: 2-hydroxyethyl methacrylate; BPDM: biphenyl dimethacrylate; Bis-GMA: bisphenol A diglycidyl ether dimethacrylate; UDMA, urethane dimethacrylate. Source: manufacturer documentation.