Impact of Solvent Evaporation and Curing Protocol on Degree of Conversion of Etch-and-Rinse and Multimode Adhesives Systems

Table 2

DC means and standard deviations (%) of adhesive systems according to testing groups.

Adhesive system	Light-curing time for 10 s			Light-curing time for 20 s
	No air-drying	Air-drying for 10 s	Air-drying for 60 s	No air-drying	Air-drying for 10 s	Air-drying for 60 s
ONE-STEP (OS)	2.0 (0.6)^R	10.9 (5.5)^P,Q,R	27.0 (4.8)^L,M	14.0 (1.2)^O,P,Q	27.9 (6.9)^L,M	38.1 (4.1)^J,K
ONE-STEP Plus (OSP)	15.6 (2.9)^O,P,Q	17.5 (3.7)^N,O,P	31.1 (1.1)^K,L	21.7 (1.3)^M,N,O	47.5 (3.3)^G,H,I	47.9 (2.7)^F,G,H,I
Ambar (AMB)	56.6 (4.1)^B,C,D,E,F	54.8 (2.0)^C,D,E,F,G	59.6 (4.1)^A,B,C,D	63.6 (6.0)^A,B,C	63.7 (2.3)^A,B,C	57.1 (3.7)^A,B,C,D,E
ScotchBond Universal (SBU)	40.3 (4.8)^I,J	42.8 (1.0)^H,I,J	49.2 (4.6)^E,F,G,H,I	65.7 (4.2)^A	64.2 (1.5)^A,B	61.4 (3.8)^A,B,C
All-Bond Universal (ABU)	6.9 (2.9)^Q,R	17.6 (3.0)^N,O,P	26.0 (1.9)^L,M,N	37.0 (4.7)^J,K	51.7 (4.4)^D,E,F,G,H	40.6 (3.5)^I,J

Means followed by different capital letters differ statistically by the Tukey test ().