Electrochemical Study on Corrosion Inhibition of Copper in Hydrochloric Acid Medium and the Rotating Ring-Disc Voltammetry for Studying the Dissolution
Figure 5
AFM topography of (a) polished copper surface without any treatment, (b) solution-treated surface without inhibitor in 0.5-M HCl, and (c) with 10-mM ATA in 0.5-M HCl.
