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International Journal of Electrochemistry
Volume 2012 (2012), Article ID 213420, 10 pages
Research Article

Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate

1Laboratório Associado de Sensores e Materiais (LAS), Instituto Nacional de Pesquisas Espaciais—INPE, 12.245-970 São José dos Campos, SP, Brazil
2Instituto de Pesquisa Energéticas e Nucleares—IPEN, Centro de Células a Combustível e Hidrogénio (CCCH), 05508-000 São Paulo, SP, Brazil

Received 31 March 2011; Revised 7 June 2011; Accepted 5 July 2011

Academic Editor: Giancarlo R. Salazar-Banda

Copyright © 2012 Jorge T. Matsushima et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The Cu/Pd bimetallic system electrodeposited on boron-doped diamond (BDD) films for application, as electrode material in the electrochemical reduction of nitrate was studied. The electrochemical behavior of Cu, Pd, and Cu/Pd bimetallic system was evaluated by cyclic voltammetry. From these results, the formation of the Cu/Pd composite was verified. In addition, Cu with different phases and a Cu/Pd phase in the composite were obtained. Morphological analysis by scanning electron microscopy (SEM) revealed a homogeneous distribution of Cu/Pd bimetallic particles with intermediary dimensions compared to those observed in Cu or Pd electrodeposits separately. These composites were tested as electrocatalysts for nitrate reduction in Britton-Robinson buffer solution (pH 9). Electrochemical measurements showed that composites with higher Cu content displayed the best electrocatalytic activity for nitrate reduction, and the Cu/Pd phase in the bimetallic system served to improve the Cu adherence on BDD electrode.