Investigation of a Cu/Pd Bimetallic System Electrodeposited on Boron-Doped Diamond Films for Application in Electrocatalytic Reduction of Nitrate

Table 1

Elemental composition (C, O, Cu, and Pd) determined by EDX analysis of the Cu/Pd composites electrodeposited on BDD electrode in solutions with different Cu(II) :  Pd(II) ratio. All were deposited applying −0.3 V by 120 s.

Cu(II) : Pd(II) ratio	Composition/% at.
	C	O	Cu	Pd
(1 : 1)	89.13	0.99	1.17	8.71
(5 : 1)	81.04	3.71	6.85	8.40
(10 : 1)	49.22	12.95	28.21	9.62