A Reuse Evaluation for Solar-Cell Silicon Wafers via Shift Revolution and Tool Rotation Using Magnetic Assistance in Ultrasonic Electrochemical Micromachining
Figure 7
Amount of Si3N4 layer and epoxy film removed at different feed rates of workpiece using different combinations of tool revolution speed (shift) and tool rotational speed (phosphoric acid 25% wt, NaNO3 15% wt, PO4-3-P 5% wt, 60°C, 40 L/min, continuous DC, 150 A, 100 kHZ/150 W, and 4000 Gauss).
