Numerical Analysis of the Dislocation Density in Multicrystalline Silicon for Solar Cells by the Vertical Bridgman Process
Figure 9
Model of the relationship between the thermal strain and the residual stress. (a) Variation of the residual stress in the elastic body from high temperature to room temperature during cooling process. (b) Variation of the residual stress in the viscoplastic body from high temperature to room temperature during cooling process.
