Material Properties of Laser-Welded Thin Silicon Foils
Figure 4
Cross-section mappings of a laser line welded sample, laser irradiation was introduced from the top side (a) EBSD mapping, color with respect to the wafer surface, crystal orientations as shown in the color map and the included cubes (b) Internal stress mapping measured by mirco-Raman, maximum compressive stress of −21.5 MPa and tensile stress of 13.0 MPa are observed.
