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International Journal of Photoenergy
Volume 2014, Article ID 807812, 8 pages
Research Article

Superior Antireflection Coating for a Silicon Cell with a Micronanohybrid Structure

1Department of Mechanical Engineering, National Chung Hsing University, Taichung 40227, Taiwan
2Graduate Institute of Biomedical Engineering, National Chung Hsing University, Taichung 40227, Taiwan
3Program in Tissue Engineering and Regenerative Medicine, National Chung Hsing University, 250 Kuo-Kuang Road, Taichung 40227, Taiwan

Received 13 January 2014; Accepted 20 March 2014; Published 10 April 2014

Academic Editor: Tao Xu

Copyright © 2014 Hsi-Chien Liu and Gou-Jen Wang. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


The object of this paper is to develop a high antireflection silicon solar cell. A novel two-stage metal-assisted etching (MAE) method is proposed for the fabrication of an antireflective layer of a micronanohybrid structure array. The processing time for the etching on an N-type high-resistance (NH) silicon wafer can be controlled to around 5 min. The resulting micronanohybrid structure array can achieve an average reflectivity of 1.21% for a light spectrum of 200–1000 nm. A P-N junction on the fabricated micronanohybrid structure array is formed using a low-cost liquid diffusion source. A high antireflection silicon solar cell with an average efficiency of 13.1% can be achieved. Compared with a conventional pyramid structure solar cell, the shorted circuit current of the proposed solar cell is increased by 73%. The major advantage of the two-stage MAE process is that a high antireflective silicon substrate can be fabricated cost-effectively in a relatively short time. The proposed method is feasible for the mass production of low-cost solar cells.