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International Journal of Polymer Science
Volume 2014, Article ID 713603, 12 pages
http://dx.doi.org/10.1155/2014/713603
Research Article

Towards a Smart Encapsulation System for Small-Sized Electronic Devices: A New Approach

1Fraunhofer Institute for Biomedical Engineering IBMT, Branch Potsdam, Am Muehlenberg 13, 14476 Potsdam, Germany
2Institute for Biochemistry and Biology, University of Potsdam, Karl-Liebknecht-Straße 24-25, 14476 Potsdam, Germany

Received 11 October 2013; Revised 19 December 2013; Accepted 20 December 2013; Published 9 February 2014

Academic Editor: Qijin Zhang

Copyright © 2014 Sebastian-Tim Schmitz-Hertzberg et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Sebastian-Tim Schmitz-Hertzberg, Rick Liese, Carsten Terjung, and Frank F. Bier, “Towards a Smart Encapsulation System for Small-Sized Electronic Devices: A New Approach,” International Journal of Polymer Science, vol. 2014, Article ID 713603, 12 pages, 2014. https://doi.org/10.1155/2014/713603.