Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-<i>co</i>-glycolic acid) Microstructures

<table class="figure-group"><tr class="fig-image" id="a"><td><object data="https://static.hindawi.com/articles/ijps/volume-2015/520512/figures/520512.fig.0012a.svgz" name="520512.fig.0012a" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(a) </b>Nonisothermal</td></tr><tr class="fig-image" id="b"><td><object data="https://static.hindawi.com/articles/ijps/volume-2015/520512/figures/520512.fig.0012b.svgz" name="520512.fig.0012b" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(b) </b>Isothermal</td></tr></table>

<div>Comparison of nonisothermal and isothermal hot embossing.</div>

International Journal of Polymer Science

fig12

Figure 12

Figure 12: Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-<i>co</i>-glycolic acid) Microstructures 

International Journal of Polymer Science

Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-co-glycolic acid) Microstructures

Figure 12