Curing Reaction and Dielectric Properties of Rigid and Elastic Liquid Crystal Epoxy Networks Modified with Nanofillers

Figure 3

Curing process of the epoxy resin and its composites: (a) 3D representation (electric modulus versus frequency and time) of curing of the epoxy resin with pimelic acid and nanorods; (b) normalized real part of permittivity () versus time for all the investigated mixtures, with solid lines representing the best fit of the chosen kinetic model to the data (inset: estimated frequency of the peak versus time for composites cured with pimelic acid).

(a)

(b)