Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane

<table class="figure-group"><tr class="fig-image" id="a"><td><object data="https://static.hindawi.com/articles/ijps/volume-2019/2916759/figures/2916759.fig.004a.svgz" name="2916759.fig.004a" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(a) </b>TG curves</td></tr><tr class="fig-image" id="b"><td><object data="https://static.hindawi.com/articles/ijps/volume-2019/2916759/figures/2916759.fig.004b.svgz" name="2916759.fig.004b" type="image/svg+xml"></object></td></tr><tr class="fig-caption"><td><b>(b) </b>DTG curves</td></tr></table>

<div>TG and DTG curves of different adhesive samples.</div>

International Journal of Polymer Science

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Figure 4

Figure 4: Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane 