International Journal of Polymer Science / 2019 / Article / Tab 3

Research Article

Curing Dynamics of Soy Flour-Based Adhesives Enhanced by Waterborne Polyurethane

Table 3

Parameters of reaction kinetics of different adhesive samples.

SamplesTemperature (°C)Fitting equationActivation energy (kJ·mol-1)Preexponential factor (s·mol·l-2)Correlation coefficient

SFA52~14746.980.9848
147~38730.580.9311

SFA-WPU557~14682.980.9723
146~25788.090.9921
257~35749.90.983
357~41754.110.9866

SFA-WPU1054~14978.630.9647
149~26780.310.922
267~34747.130.9919
347~45078.620.9743

SFA-WPU1550~13580.970.9816
135~24280.230.9746
242~38049.110.9911
380~48189.110.991

SFA-WPU2055~13472.80.9603
134~25385.740.961
253~385440.9519
385~488100.780.9723