Table of Contents Author Guidelines Submit a Manuscript

Polymers and Polymeric Composites with Electronic Applications

Call for Papers

The development of the modern society has resulted in all kinds of electronic equipment and devices which are made from electronic materials. Compared with the inorganic electronic materials, the polymer based electronic materials have attracted considerable attention due to their relatively low weight density, flexibility, high processability, low manufacturing cost, and even recyclability. In recent years, polymers and polymeric composites used as dielectric materials and conducting materials have been actively explored. In addition, the polymers used as functional materials in capacitors, batteries/cells, sensors/actuators, and others have also been reported.

This special issue is intended to provide a platform for researchers and engineering to present the latest progress in the broad research area on the preparation, manufacture, characterization, performances and application of new polymer based electronic materials

In this special issue, we sincerely invite you to contribute high quality, unpublished work within the scope of this special issue. In addition, original research articles as well as review articles focused on the developments and critical issues in the related areas are also welcome.

Potential topics include but are not limited to the following:

  • Dielectric properties of polymers
  • Conducting polymers
  • Polymer composites used in capacitors, batteries, and/or cells
  • Polymer composites used as electromagnetic absorption and shielding materials
  • Polymer composites used in sensors and actuators
  • Polymer based piezoelectric materials
  • Polymer based thermoelectric materials
  • Liquid crystalline polymers

Authors can submit their manuscripts through the Manuscript Tracking System at

Submission DeadlineFriday, 13 April 2018
Publication DateAugust 2018

Papers are published upon acceptance, regardless of the Special Issue publication date.

Lead Guest Editor

  • Renbo Wei, University of Electronic Science and Technology of China, Chengdu, China

Guest Editors