Research Article

Architecture-Level Exploration of Alternative Interconnection Schemes Targeting 3D FPGAs: A Software-Supported Methodology

Figure 1

Variation on interconnection length for (a) a 2D device, (b) a 3D architecture with two layers, and (c) a 3D architecture with four layers.
764942.fig.001a
(a)
764942.fig.001b
(b)
764942.fig.001c
(c)