International Journal of Reconfigurable Computing / 2010 / Article / Tab 3

Research Article

Power Characterisation for Fine-Grain Reconfigurable Fabrics

Table 3

Details of FPGAs used for our fabric characterisation experiment.

FPGA family  Device Board Process technology Core voltage Thermal resistance Number of LUTs/FFs Number of RNGs Logic utilisation

Xilinx Virtex-II Pro [9] XC2VP30 XUP 130 nm 1.5 V 0.6°C/W 27,392 48 89.7%
Xilinx Spartan-3E [17] XC3S500E Spartan-3E Starter Kit 90 nm 1.2 V 9.8°C/W 9,312 16 88%
Xilinx Spartan-3AN [17] XC3S700AN Spartan-3AN Starter Kit 90 nm 1.2 V 5.3°C/W 11,776 21 91.3%
Xilinx Virtex-5 [23] XC5VLX50T ML505 65 nm 1.0 V 0.2°C/W 28,800 50 88.9%
Silicon Blue iCE65 [20] iCE65L04 iCEman Eval Kit 65 nm 1.2 V n/a 3,520 6 87.3%