Table of Contents Author Guidelines Submit a Manuscript
Journal of Chemistry
Volume 2015, Article ID 872516, 11 pages
http://dx.doi.org/10.1155/2015/872516
Research Article

2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid in an Electroless Nickel-Plating Bath

Department of Chemical Engineering, Faculty of Chemical and Metallurgical Engineering, Yildiz Technical University, 34220 Istanbul, Turkey

Received 11 August 2015; Accepted 22 October 2015

Academic Editor: Takeshi Kondo

Copyright © 2015 Ahmet Ozan Gezerman and Burcu Didem Çorbacıoğlu. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Linked References

  1. P. K. Yee, W. T. Wai, and Y. F. Khong, “Palladium-copper inter-diffusion during copper activation for electroless Nickel plating process on Copper power metal,” in Proceedings of the 21st International Symposium on the IEEE Physical and Failure Analysis of Integrated Circuits (IPFA '14), pp. 219–222, IEEE, Singapore, July 2014. View at Publisher · View at Google Scholar
  2. Z. Shao, Z. Cai, R. Hu, and S. Wei, “The study of electroless nickel plating directly on magnesium alloy,” Surface and Coatings Technology, vol. 249, pp. 42–47, 2014. View at Publisher · View at Google Scholar · View at Scopus
  3. P. Liu, C. Li, X. Liang et al., “Recovery of high purity ferric phosphate from a spent electroless nickel plating bath,” Green Chemistry, vol. 16, no. 3, pp. 1217–1224, 2014. View at Publisher · View at Google Scholar · View at Scopus
  4. S. Fujii, H. Hamasaki, H. Takeoka, T. Tsuruoka, K. Akamatsu, and Y. Nakamura, “Electroless nickel plating on polymer particles,” Journal of Colloid and Interface Science, vol. 430, pp. 47–55, 2014. View at Publisher · View at Google Scholar · View at Scopus
  5. J. Rajaguru, M. Duke, and C. Au, “Development of rapid tooling by rapid prototyping technology and electroless nickel plating for low-volume production of plastic parts,” International Journal of Advanced Manufacturing Technology, vol. 78, no. 1–4, pp. 31–40, 2015. View at Publisher · View at Google Scholar · View at Scopus
  6. Y.-J. Yim, K. Y. Rhee, and S.-J. Park, “Influence of electroless nickel-plating on fracture toughness of pitch-based carbon fibre reinforced composites,” Composites Part B: Engineering, vol. 76, pp. 286–291, 2015. View at Publisher · View at Google Scholar
  7. G.-P. Jin, Y. Fu, X.-C. Bao, X.-S. Feng, Y. Wang, and W.-H. Liu, “Electrochemically mediated atom transfer radical polymerization of iminodiacetic acid-functionalized poly(glycidyl methacrylate)grafted at carbon fibers for nano-nickel recovery from spent electroless nickel plating baths,” Journal of Applied Electrochemistry, vol. 44, no. 5, pp. 621–629, 2014. View at Publisher · View at Google Scholar · View at Scopus
  8. L. Li, N. Takahashi, K. Kaneko, T. Shimizu, and T. Takarada, “A novel method for nickel recovery and phosphorus removal from spent electroless nickel-plating solution,” Separation and Purification Technology, vol. 147, pp. 237–244, 2015. View at Publisher · View at Google Scholar
  9. X. Shu, Y. Wang, C. Liu, A. Aljaafari, and W. Gao, “Double-layered Ni-P/Ni-P-ZrO2 electroless coatings on AZ31 magnesium alloy with improved corrosion resistance,” Surface and Coatings Technology, vol. 261, pp. 161–166, 2015. View at Publisher · View at Google Scholar · View at Scopus
  10. W. Liu, Q. Huang, and G. Hu, “A novel preparation route for multi-doped LiFePO4/C from spent electroless nickel plating solution,” Journal of Alloys and Compounds, vol. 632, pp. 185–189, 2015. View at Publisher · View at Google Scholar · View at Scopus
  11. S. Tengsuwan and M. Ohshima, “Supercritical carbon dioxide-assisted electroless nickel plating on polypropylene—the effect of copolymer blend morphology on metal-polymer adhesion,” The Journal of Supercritical Fluids, vol. 85, pp. 123–134, 2014. View at Publisher · View at Google Scholar · View at Scopus
  12. K. Y. Lee, J. T. Huang, P. S. Chao, J. M. Lin, and H. J. Hsu, “An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip,” Microelectronic Engineering, vol. 113, pp. 147–151, 2014. View at Publisher · View at Google Scholar · View at Scopus
  13. P. Sittisart, M. M. Hyland, M. A. Hodgson, C. Nguyen, and A. Fernyhough, “Preparation and characterization of electroless nickel-coated cellulose fibres,” Wood Science and Technology, vol. 48, no. 4, pp. 841–853, 2014. View at Publisher · View at Google Scholar · View at Scopus
  14. H. Y. Lee, B. W. Cho, and J. K. Lee, “U.S. Patent No. 8,801,916,” US Patent and Trademark Office, Washington, DC, USA, 2014.
  15. O. O. Ajibola, D. T. Oloruntoba, and B. O. Adewuyi, “Effects of hard surface grinding and activation on electroless-nickel plating on cast aluminium alloy substrates,” Journal of Coatings, vol. 2014, Article ID 841619, 10 pages, 2014. View at Publisher · View at Google Scholar
  16. X.-H. Zhu, F. Xie, J. Li, and G.-P. Jin, “Simultaneously recover Ni, P and S from spent electroless nickel plating bath through forming graphene/NiAl layered double-hydroxide composite,” Journal of Environmental Chemical Engineering, vol. 3, no. 2, pp. 1055–1060, 2015. View at Publisher · View at Google Scholar
  17. M. Jagannatham, S. Sankaran, and H. Prathap, “Electroless nickel plating of arc discharge synthesized carbon nanotubes for metal matrix composites,” Applied Surface Science, vol. 324, pp. 475–481, 2015. View at Publisher · View at Google Scholar · View at Scopus
  18. T. Nagano, H. Mitamura, Y. Yamashita, N. Yanase, H. Suzuki, and H. Naganawa, “Continuous liquid-liquid extraction of nickel from simulated electroless nickel plating liquid wastes by using a counter current emulsion flow extractor,” Solvent Extraction Research and Development, vol. 21, no. 1, pp. 111–117, 2014. View at Publisher · View at Google Scholar · View at Scopus
  19. K. Miyama, K. Yoshida, S. Saitou, and T. Takashima, “Effects of internal stress of electroless Ni plating on solder joining strength,” in International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC '15), pp. 800–803, Kyoto, Japan, April 2015. View at Publisher · View at Google Scholar
  20. W. Zhu, Y. C. Zhou, J. W. Guo, L. Yang, and C. Lu, “Quantitative characterization of the interfacial adhesion of Ni thin film on steel substrate: a compression-induced buckling delamination test,” Journal of the Mechanics and Physics of Solids, vol. 74, pp. 19–37, 2015. View at Publisher · View at Google Scholar · View at Scopus
  21. Y. Ren, G.-S. Zhou, D.-L. Chai, and X.-P. Qiao, “On the formation of the interlayer between Ni-P coating and AZ33 magnesium alloy substrate by means of in situ SEM observation,” Chinese Chemical Letters, vol. 25, no. 6, pp. 947–952, 2014. View at Publisher · View at Google Scholar · View at Scopus
  22. V. G. Pol, M. M. Thackeray, K. Mistry, and A. Erdemir, “U.S. Patent No. 8,648,019,” US Patent and Trademark Office, Washington, DC, USA, 2014.
  23. D.-W. Deng, C.-G. Wang, Q.-Q. Liu, and T.-T. Niu, “Effect of standard heat treatment on microstructure and properties of borided Inconel 718-TNMSC,” The Chinese Journal of Nonferrous Metals, vol. 25, no. 2, 2015. View at Google Scholar
  24. Y. J. Ye, P. Y. Wang, Y. P. Li, and D. C. Yin, “HAp/Ti2Ni coatings of high bonding strength on Ti-6Al-4V prepared by the eutectic melting bonding method,” Journal of Materials Science: Materials in Medicine, vol. 26, no. 2, article 81, 11 pages, 2015. View at Publisher · View at Google Scholar
  25. C. K. Lee, C. S. Chang, A. H. Tan, C. Y. Yang, and S. L. Lee, “Preparation of electroless nickel-phosphorous-TiO2 composite coating for improvement of wear and stress corrosion cracking resistance of AA7075 in 3.5% NaCl,” Key Engineering Materials, vol. 656-657, pp. 74–79, 2015. View at Google Scholar
  26. J. Amer, “Influence of multiple electroless nickel coatings on beech wood: preparation and characterization,” Composite Interfaces, vol. 21, no. 3, pp. 191–201, 2014. View at Publisher · View at Google Scholar · View at Scopus