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Journal of Chemistry
Volume 2017 (2017), Article ID 1986071, 10 pages
Research Article

Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil

1Faculty of Chemistry, VNU-University of Science, Vietnam National University-Hanoi, 19 Le Thanh Tong, Hoan Kiem, Hanoi 10000, Vietnam
2Thai Nguyen University of Education, Thai Nguyen University, 20 Luong Ngoc Quyen, Quang Trung, Thai Nguyen, Vietnam

Correspondence should be addressed to Tien Duc Pham

Received 29 December 2016; Accepted 13 February 2017; Published 2 March 2017

Academic Editor: Khalid Z. Elwakeel

Copyright © 2017 Tien Duc Pham et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study. Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis. The optimum conditions for removal of Cu2+ by adsorption using SML were systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5 mg/mL, and ionic strength 10 mM NaCl. The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS). Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+. The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR. The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS from laterite surface was enhanced by increasing salt concentration. Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model. Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite.