Data Mining for Material Feeding Optimization of Printed Circuit Board Template Production

Table 1

Variables specification.

Number	Variable name	Symbol	Description	Value range
Overall characteristics
1	PCB thickness	Pt	Thickness of the ordered PCB	0.3–8
2	Layer number	Ln	Number of copper layers	4–20
3	Rogers material	Ro	Whether substrate material is Rogers	0/1
4	Plating frequency	Plfr	Number of plating operations	0–4
5	Number of operations	Noo	Number of operations to produce the order	16–71
6	Number of Prepregs	NPP	Number of Prepregs for lamination	1–50
7	Scrap units in a set	Sus	Allowed maximum scrap units in a set	0–8
8	Photoelectric board	Photb	Whether the order is the specified board	0/1
9	High frequency board	Highfb
10	Test board	Semictb
11	Negative film plating	Nflp	Whether the order takes negative film plating
12	Tinning copper	Tinc	Whether the order has tinning copper
13	IPCIII standard	IPCIII	Whether the order takes IPCIII or Huawei standard
14	Huawei standard	Huawei
Feature of internal/outer layer line
15	Minimum line width in internal layer (mil)	Mwil	Minimum line width or space in core boards	0.1–100
16	Minimum line space in internal layer (mil)	Mlsil		0.1–137.66
17	Minimum line width in outer layer (mil)	Mwol	Minimum line width or space in outer layer	1–157.5
18	Minimum line space in outer layer (mil)	Mlsol		1.2–290
19	Average residual rate	Arcr	Average residual rate of copper layer	0.15%–94.75%
Feature and operation information of hole
20	Solder resist plug hole	Srph	Whether the order has the specified hole related operation	0/1
21	Plug hole with resin	Phwr
22	Second drilling	Secd
23	Back drilling	Bcdr
Operation information of character/solder mask
24	Character print	Chaprt	Whether the order has the specified character/solder mask related operation	0/1
25	White oil solder mask	White
26	Blue oil solder mask	Blue
27	Black oil solder mask	Black
Surface finishing operation options
28	Hot air solder leveling	Hasl	Whether the order takes the specified surface finishing operation	0/1
29	Lead-free hot air solder leveling	Lfhasl
30	Entek	Osp
31	Cu/Ni/Au pattern plating	Cnapp
32	Gold finger plating	Gfig
33	Gold plating	Godp
34	Soft Ni/Au plating	Snap
35	Immersion Ag/Sn/Au	Iasa
Statistic items
36	Delivery unit in a panel	Duap	Number of delivery units in a panel	1–262
37	Supplemental feeding frequency	Supff	Material feeding frequency minus 1	0–14
38	Required quantity	Reqq	Demand quantity of delivery unit minus delivery unit in inventory for the same order number	1–3,000
39	Required panel	Reqp	Reqq/Duap rounded up to the nearest integer	1–225
40	Feeding quantity	Fedq	Feeding number of delivery units	2–6296
41	Least feeding panel	Lfp	rounded up to the nearest integer	1–245
42	Feeding panel	Fedp	Number of feeding panels	1–308
43	Scrap quantity	Scraq	Scrap number of delivery units	0–712
44	Qualified quantity	Qualq	Qualified number of delivery units	1–6,226
45	Surplus quantity	Surpq	Qualq-Fedq	0–3,226
46	Delivery unit area (m^2)	Dunita	Area of a delivery unit	0.001–0.393
47	Required area (m^2)	Reqa	Reqq × Dunita	0.001–25.74
48	Feeding area (m^2)	Feda	Fedq × Dunita	0.011–42.63
49	Scrap area (m^2)	Scraa	Scraq × Dunita	0–15.39
50	Qualified area (m^2)	Quala	Qualq × Dunita	0.009–37.49
51	Surplus area (m^2)	Surpa	Surpq × Dunita	0–25.45
52	Supplemental feeding rate	Supfr	Supff in a certain period/number of orders × 100%	19.84%
53	Scrap rate	Scrar	Scraa/Feda × 100%	0%–72.58%
54	Qualified rate	Qualr	Quala/Feda × 100%	27.42%–100%
55	Surplus rate	Surpr	Surpa/Reqa × 100%	0–827.18%
56	Historical qualified rate	Hquar	The Qualr for the same order number in the past 2 years	8.824%–100%

Note. New orders having no Hquar are replaced by the Qualr for orders having the same layer number and surface finishing operation during the past 2 years.