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Journal of Healthcare Engineering
Volume 2017 (2017), Article ID 5134021, 9 pages
Research Article

A 3D Scan Model and Thermal Image Data Fusion Algorithms for 3D Thermography in Medicine

1Faculty of Electrical Engineering and Communication, Brno University of Technology, Brno, Czech Republic
2Faculty of Information Technology, IT4Innovations Centre of Excellence, Brno University of Technology, Brno, Czech Republic

Correspondence should be addressed to Adam Chromy

Received 6 April 2017; Revised 3 September 2017; Accepted 4 October 2017; Published 8 November 2017

Academic Editor: David Moratal

Copyright © 2017 Adam Chromy and Ondrej Klima. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


Objectives. At present, medical thermal imaging is still considered a mere qualitative tool enabling us to distinguish between but lacking the ability to quantify the physiological and nonphysiological states of the body. Such a capability would, however, facilitate solving the problem of medical quantification, whose presence currently manifests itself within the entire healthcare system. Methods. A generally applicable method to enhance captured 3D spatial data carrying temperature-related information is presented; in this context, all equations required for other data fusions are derived. The method can be utilized for high-density point clouds or detailed meshes at a high resolution but is conveniently usable in large objects with sparse points. Results. The benefits of the approach are experimentally demonstrated on 3D thermal scans of injured subjects. We obtained diagnostic information inaccessible via traditional methods. Conclusion. Using a 3D model and thermal image data fusion allows the quantification of inflammation, facilitating more precise injury and illness diagnostics or monitoring. The technique offers a wide application potential in medicine and multiple technological domains, including electrical and mechanical engineering.