Origin of the Difference in the Resistivity of As-Grown Focused-Ion- and Focused-Electron-Beam-Induced Pt Nanodeposits
Figure 3
The image on the left top is a SEM picture of the electrical pads patterned by optical lithography together with the two microprobes contacted for in-situ control of the deposit resistance. The image on the right top is a SEM picture of one typical deposit closing the gap between the contact electrodes for the measurement of the resistance. The shown results of resistance versus time correspond to the comparison between several Pt samples grown by FEBID and FIBID. Resistance monitorization starts after 6.3 minutes in the case of the FEBID process and 1.5 minutes in the case of the FIBID process. The final deposit thickness is approximately the same (160 nm) in all cases (see text for details). For the sake of clarity, zero time is the starting point of the resistance monitorization in all cases.
